Huarui yakakwira tembiricha nickel-based alloy IN625 hupfu hupfu hwakagadziridzwa, kunyanya yakakodzera SLM kugadzira tekinoroji, kusanganisira EOS Selective Laser Melting Equipment (EOSINT M Series), Concept Laser Melting Equipment, Renishaw Laser Melting Equipment, American 3D Systems Laser Melting Equipment, uye masangano ekutsvakurudza epamba uye masangano.
Kuburikidza neakasiyana particle saizi yekugovera, inogona zvakare kukamurwa kuita jekiseni rekuumba poda, laser cladding poda, yekufirita poda, inopisa isostatic yekutsikirira poda uye zvichingodaro.
Kemikari Inoumbwa (%) yeInconel 625 Powder | ||||||
Cr | Co | Al | Mo | Mn | Ti | Nb |
20-23 | ≤1.0 | ≤0.4 | 8.0-10 | ≤0.5 | ≤0.4 | 3.15-4.15 |
Fe | C | Si | P | S | O | Ni |
≤0.5 | ≤0.1 | ≤0.5 | ≤0.015 | ≤0.15 | ≤0.02 | Bal |
Inooneka Density: 4.50g/cm3 | Ruvara: grey | Chimiro: denderedzwa | ||||
Particle Size | 15-53micron;45-105micron;45-150micron |
Inconel 625 Powder Properties | ||||||
Size Range | 0 ~ 25um | 0 ~ 45um | 15 ~ 45um | 45 ~ 105um | 75 ~ 180um | |
Morphology | Spherical | Spherical | Spherical | Spherical | Spherical | |
Particle Size Distribution | d10:6um | d10:9um | D10: 14um | D10: 53um | D10: 78um | |
D50:16um | D50: 28um | D50: 35um | D50: 69um | D50: 120um | ||
D90: 23um | D90: 39um | D90: 45um | D90: 95um | D90: 165um | ||
Kuyerera kugona | N/A | ≤30S | ≤28S | ≤16S | ≤18S | |
Apparent Density | 4.2g/cm3 | 4.5g/cm3 | 4.4g/cm3 | 4.5g/cm3 | 4.4g/cm3 | |
Zvemukati Okisijeni (wt %) | O: 0.06~0.018wt% , ASTM chiyero : ≤0.02 wt% | |||||
3D kudhinda Gasi Atomized Inconel 625 Powder nemutengo wakanakisa | ||||||
(yakaderera oksijeni, yakakwirira sphericity uye yakanaka fluidity) |
1. HVOF
2. Plasma coating
3. 3D kudhinda / kuwedzera kugadzira
4. upfu welding
5. simbi jekiseni kuumba
6. inopisa isostatic
Isu tinopawo Inconel 718 powder, NiCr powder, NiAl powder, Ni20-Ni65 powder, tinogamuchirwa kubvunza!