Spherical Alumina Powder yeThermal Interface Materials
Product Description
HRK yakatevedzana spherical alumina inogadzirwa nepamusoro tembiricha yekunyungudika-jet nzira inokura pane yakajairwa chimiro Al2O3, uye yobva yaongororwa, kucheneswa uye mamwe maitiro ekuwana chigadzirwa chekupedzisira.Iyo yakawanikwa alumina ine yakakwira spheroidization mwero, inodzoreka particle saizi kugovera uye yakanyanya kuchena.Nekuda kwehunhu hwayo hwakasiyana senge yakakwira yekupisa conductivity uye kufamba kwakanaka, Chigadzirwa chacho chave chichishandiswa zvakanyanya sechizadziso chezvinopisa zvemukati, thermal engineering mapurasitiki uye aluminium-based Copper-Clad Laminates zvichingodaro.
SEM
Product Features
| Technical chinhu | Unit | HRK Series chigadzirwa Code | ||||||||||
| Particle Size | HRK-1 | HRK-2 | HRK-5 | HRK-10 | HRK-20 | HRK-30 | HRK-40 | HRK-70 | HRK-90 | HRK-120 | ||
| (D10) | µm | 0.71 | 0.69 | 2.54 | 4.55 | 10.5 | 16.88 | 23.77 | 44.32 | 55.23 | 92.39 | |
| (D50) | µm | 1.08 | 2.18 | 5.52 | 10.43 | 20.8 | 30.52 | 41.54 | 71.54 | 87.96 | 122.98 | |
| (D90) | µm | 3.21 | 5.24 | 9.09 | 20.8 | 37.24 | 48.87 | 66.44 | 106.5 | 134.92 | 172.07 | |
| Specific Surface Area | m2/g | 1.69 | 1.27 | 0.36 | 0.17 | 0.14 | 0.13 | 0.12 | 0.12 | 0.1 | 0.06 | |
| Electrical Conductivity | iwe S/cm | 6.07 | 5.4 | 5.65 | 4.05 | 6.87 | 7.95 | 4.65 | 6.18 | 8.15 | 6.45 | |
| PH Kukosha | - | 7.53 | 7.79 | 7.7 | 7.9 | 7.62 | 7.7 | 7.8 | 7.7 | 7.9 | 7.54 | |
| Unyoro | % | 0.05 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.04 | |
| True Density | g/cm3 | 3.71 | 3.7 | 3.74 | 3.76 | 3.79 | 3.79 | 3.81 | 3.87 | 3.88 | 3.89 | |
| Spheroidization Rate | % | 96 | 98 | 98 | 98 | 96 | 98 | 96 | 96 | 95 | 95 | |
| Kuumbwa Kwemakemikari | Al2O3 | % | 99.87 | 99.94 | 99.89 | 99.94 | 99.92 | 99.93 | 99.94 | 99.92 | 99.94 | 99.92 |
| SiO2 | ppm | 430 | 30 | 430 | 20 | 150 | 20 | 20 | 30 | 20 | 170 | |
| Fe2O3 | ppm | 140 | 70 | 140 | 40 | 60 | 60 | 50 | 60 | 60 | 140 | |
| Na2O | ppm | 90 | 100 | 10 | 60 | 140 | 90 | 110 | 90 | 70 | 90 | |
Application
● Thermal Interface Materials: thermal silica pad, thermal grease, thermally conductive potting glue, phase change materials;
● Thermally Conductive Engineering Plastics: Chivharo chemwenje che LED, shandura shell, ganda rezvigadzirwa zvemagetsi, zvigadzirwa zvemagetsi zvinopisa kupisa zvikamu;
● Al-based Copper Clad Laminate: high-power LED circuit substrate, mabhodhi emagetsi emagetsi, nezvimwewo;
● Alumina Ceramic Filters;
Thermal Spray Coating.
